Stencil and screen cleaner
A high-capacity cleaner for wafer bump masks. Ultrasonic plus spray handles solder paste and ink paste, from □320 mm to □750 mm.
Features
Dual cleaning
Ultrasonic and spray together handle solder paste and ink paste.
Before
After
A wide size range
From L 320 × W 320 mm to L 1,000 × W 700 mm. Stencils set in one touch.
Simple operation
One button runs cleaning through drying.
Video
Specifications
- Maker
- Sawa Corporation
- Model
- SC-BM500E
- Size / weight
- W 780 × D 1,100 × H 1,847 mm / about 250 kg
- Power
- AC 100 V 50/60 Hz / 550 VA
- Stencils
- L 320 × W 320 mm to L 1,000 × W 700 mm
- Air
- 0.4 MPa / 600 NL/min
- Exhaust
- 5 m/sec
| Maker | Sawa Corporation |
|---|---|
| Model | SC-BM500E |
| Size / weight | W 780 × D 1,100 × H 1,847 mm / about 250 kg |
| Power | AC 100 V 50/60 Hz / 550 VA |
| Stencils | L 320 × W 320 mm to L 1,000 × W 700 mm |
| Air | 0.4 MPa / 600 NL/min |
| Exhaust | 5 m/sec |
Specs and appearance may change without notice.
Metal stencil cleaner comparison
| Model |  SC-AH150 |  SC-AH100E-LV |  SC-ML736E |  SC-BM500E |
|---|---|---|---|---|
| Character | Volume and speed | High performance, automation | The standard, compact | Bump and large formats |
| Size (mm) | L 550 × W 600 L 550 × W 650 L 736 × W 736 | L 550 × W 600 L 550 × W 650 L 736 × W 736 | L 550 × W 600 L 550 × W 650 L 736 × W 736 | □320〜□750 |
| External size (mm) | W 970 × D 1,198.5 × H 1,667 | W 877 × D 1,140 × H 1,666 | W 1,290 × D 553 × H 1,466 | W 780 × D 1,100 × H 1,847 |
| Point | From 3 min 30 sec a stencil. Liquid use is half the previous model. | Ultrasonic plus suction. A five-stencil run is available. | More than 500 units in the field. A general machine with a small footprint. | Ultrasonic plus spray. It also takes ink paste. |
Contact
If you have a question or would like to talk, please get in touch.