High-wetting water-based cleaner for underside wiping
VIGON® UC 160 is a water-based cleaner made to remove solder paste from metal stencils in an SMT printer. Strong wetting improves cleaning and greatly reduces smeared paste on the underside. It also keeps paste off the board, so printing stays reliable. With no flash point and low VOC, it is a practical IPA alternative.
Benefits
Effective paste removal, including after idle time
Underside wiping removes current lead-free and eutectic pastes from the stencil, including fine-pitch work.
Strong wetting
It wets the stencil well, so cleaning improves and underside smearing drops sharply. That helps prevent solder bridges on the board.
Stable print deposit
A stable deposit helps keep solder balls down.
Safer to handle
No flash point and low VOC make it a practical IPA alternative.
Product traits
Underside wiping
MPC® technology
Neutral
Contact
If you have a question or would like to talk, please get in touch.