Water-based cleaner for reflow ovens and solder pots

VIGON® RC 303 is designed to remove every kind of baked-on flux residue from reflow ovens and solder pots. It takes off built-up flux and deposits that come off the board. As the successor to VIGON® RC 101, it cleans better and is safer to handle.

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Water-based cleaner for reflow ovens and solder pots

Benefits

  • Clean without a long shutdown

    The formula shortens soak time. It can go directly on low- and mid-temperature surfaces (20–50°C), and it is also suited to pre-cleaning a flux trap.

  • Strong cleaning and a reliable process

    Cleaning is improved, and the formula does not use ingredients that leave residue on the reflow surface.

  • Manual and automatic cleaning

    Use it by hand on a reflow oven or wave solder, and in an automatic cleaner for wave-solder conveyor fingers.

  • Very good material compatibility

    It is compatible with aluminum and epoxy surfaces.

  • A mild formula

    Low odor and no flash point make it safer for operators. It is gentle on the environment and carries no hazardous-goods label.

Product traits

  • Maintenance cleaning

  • Manual wipe cleaning

  • Spray bottle

  • MPC® technology

Video

How to use

  1. 1. Spray it directly onto a low- or mid-temperature surface. (1 L bottle)

  2. 2. Leave it for about 5 to 10 minutes, then wipe the surface with a cloth or paper towel.

  3. 3. Let it dry in the air.

Contact

If you have a question or would like to talk, please get in touch.

FIDEA Corporation (Thailand) Co., Ltd.

+66 (0) 2-714-7621Sales@fidea.co.th

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