Flux remover for reflow and wave solder equipment

Based on the MPC Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies. The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts.

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Flux remover for reflow and wave solder equipment

Benefits

  • No flash point, for cold or warm surfaces

    Has no flash point and therefore can be applied directly onto cold or warm surfaces.

  • Short soaking time

    Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided.

  • A mild formula

    Has a mild formulation with a low alkaline pH-value. Therefore, no special labeling is required.

  • Excellent material compatibility

    Excellent material compatibility with aluminum and epoxy surfaces.

  • Pre-cleaning of condensation traps

    The cleaning agent is also suitable for the pre-cleaning of condensation traps.

  • Little odor

    Has little odor.

  • Less cleaner than IPA

    Reduced cleaning agent consumption compared to IPA.

  • Safer for the operator

    Its no flashpoint formulation significantly increases the operator's safety.

  • Biodegradable

    Biodegradable.

  • Environmentally friendly, non-hazardous

    Formulated free of halogenated compounds and is very environmentally friendly and considered a non-hazardous material.

  • No special handling

    No special precaution for handling is required.

Product traits

  • Maintenance cleaning

  • Manual wipe cleaning

  • Low alkaline

  • MPC® technology

Contact

If you have a question or would like to talk, please get in touch.

FIDEA Corporation (Thailand) Co., Ltd.

+66 (0) 2-714-7621Sales@fidea.co.th

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