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Zestron

Cleaning Solutions

VIGON® RC303

Water-based cleaning medium for manual cleaning of reflow ovens and wave solder systems

VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

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  • Areas of application

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  • Advantages compared to other cleaners

    • Higher cleaning quality and process reliability:

      • Improved cleaning performance

      • The medium does not contain any ingredients which could leave residues on the oven surfaces; therefore, avoiding harmful condensation on the assembly surfaces after restarts.

      • Excellent material compatibility with aluminum and epoxy surfaces

    • Mild formulation:

      • No flash point

      • High operator safety

      • Environmentally friendly

      • No hazardous labeling

      • Little odor

    • en:"More efficient cleaning process to avoid long machine downtimes" th: กระบวนการทำความสะอาดที่มีประสิทธิภาพมากขึ้นเพื่อหลีกเลี่ยงเวลาหยุดทำงานของเครื่องจักรที่ยาวนาน

      • Short soaking time due to advanced formulation

      • Can be applied directly onto cold or warm surfaces (20 - 50 °C / 68 - 122 °F)

      • Also suitable for the pre-cleaning of condensation traps



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Machine Test Center

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Analytical Center


Technical Data*

Density

(g/ccm) at 20°C/68°F

1.01

Surface tension

(mN/m) at 25°C/77°F

31,8

Boiling point

°C/°F

/ 210.2°F

Flash point

°C/°F

None

pH value

10g/l H2O

10.1

Vapor pressure

(mbar) at 20°C/68°F

Approx. 22

Cleaning temperature

°C/°F

20-50°C / 68-122°F

Solubility in water

-

Soluble

Application


concentration

Ready-to-use

Pure

HMIS Rating

Health-Flammability-Reactivity

1 - 0 - 0

Density

(g/ccm) at 20°C/68°F

1.01

* Please note that the information above represents ATRON® SP 300 as a ready-to-use mixture.

*1 ATRON® SP 300 concentrate has to be diluted in DI-water.


Product Features & Cleaning Standards

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100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)


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Extensively tested and suitable for cleaning lead-free solder pastes


Typical applications

  1. Manual cleaning of reflow ovens and wave solder equipment

    1. Spray directly onto cold or warm surfaces (1l bottle)

    2. Allow cleaning agent to stand for approximately 5 min

    3. Wipe surface clean with a cloth or paper towel

    4. Air dry

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2. Automated cleaning of conveyor fingers in wave solder equipment

a.　Fill the cleaning reservoir of the wave solder equipment with VIGON® RC 303

b.　Automatic brushing device in wave solder system wipes conveyor fingers clean

c.　Air dry


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Environmental, health & safety regulations

  • VIGON® RC 303 is water-based and biodegradable.

  • VIGON® RC 303 ได้รับการคิดค้นขึ้นโดยปราศจากสารประกอบฮาโลเจน จึงเป็นมิตรต่อสิ่งแวดล้อม

  • Refer to the SDS for specific handling precautions and instructions.

  • This product is a non-hazardous material and according to EU standard special labeling is not required.


Supplementary equipment

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  • Pressure Sprayer:

    • For easy and fast dispensing in reflow oven and wave soldersystem cleaning applications

    • Especially developed for spraying large surfaces within seconds

    • Capacity: 1 liter

    • Part number: 6991-0000


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